단일 칩(Single-Die) 5G/NTN 통합 베이스밴드 SoC 반도체 공학
Core engineering and protocols for Single-Die 5G/NTN Baseband SoC Integration.
Technical Specification Architecture
Core engineering and protocols for Single-Die 5G/NTN Baseband SoC Integration.
Implementation & Spacecraft Integration
Orbital deployments adhere strictly to 3GPP NTN specifications, CCSDS packet telemetry, and radiation-hardened spaceborne payload standards.
- Sub-millisecond synchronization across high-velocity Low Earth Orbit constellations.
- Radiation-hardened spaceborne transceivers supporting 3GPP NR-NTN Release 17/18/19.
- Seamless handover management bridging non-terrestrial orbits with terrestrial cellular cores.
도메인 포트폴리오 살펴보기